Laptop computer designers, audio amplifier makers, and power supply manufacturers can keep their products cooler by following these fundamental heat-sink design equations for natural convection and forced-air cooling.

Power transistors and modules, many power-supply regulator assemblies, and high-current diodes typically generate more heat than their own mass can safely dissipate. For this reason, power devices must securely fasten to a suitable heat sink to effectively increase the mass and surface area of their heat-dissipating junctions. Heat sinks come in a wide variety of shapes, sizes, colors, and surface finishes for specific and general applications for semiconductor circuitry.

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